Kutsal Mustafacan
1.039 440


The intentional use of conventional tin-lead (Sn-Pb) solder alloys was restricted with legislations across the world due to the toxic nature and the adverse effects of lead on health and the environment. Consequently, the development of new lead-free solder alloys has become a significant area of research. In addition to these health concerns, the continuing miniaturization trend of the consumer electronics has been pushing the production of solders from bulk form to powder form. In this study, a cheap gas atomization-like device was developed and the characterization of the millimeter to micron sized powders were performed using scanning electron microscopy (SEM) and differential scanning calorimetry (DSC) techniques.

Micrographs for fine powder; general view (upper left), eutectic structure (upper right), an intermetallic from the matrix (lower left), wetting angle (lower right).


Lead-free solder, Gas Atomization, Microstructure

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